Evaluation of Semiconductor Encapsulation Materials

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In the midst of a trend toward energy efficiency such as improvements in fuel efficiency, power semiconductors for electric power control are attracting attention. The adoption of low-loss elements having current density raised by use of a high-heat-resistance semiconductor such as SiC is going on especially in the area of transportation equipment that deals with high power, among other fields. Since these elements can be used in a higher-temperature environment than with the conventional elements, the packaging materials including encapsulation materials are required to have higher heat resistance and the capacity to be able to operate at high temperature. Here are given examples of packaging materials meeting such requirements of higher heat resistance and capacity to be able to operate at high temperature.

Insulation properties: Evaluation of temperature/ humidity dependence of volume resistance

Adhesive properties: Cross section observance with SEM

Heat resistance
(glass translation temp. (Tg), curing behavior)

Changes with time in crosslinking reaction of epoxy resin

Search Number 9046

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