Comprehensive Evaluation of Semiconductor Encapsulation Materials

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In the midst of a trend toward energy efficiency such as improvements in fuel efficiency, power semiconductors for electric power control are attracting attention. The adoption of low-loss elements having current density raised by use of a high-heat-resistance semiconductor such as SiC is going on especially in the area of transportation equipment that deals with high power, among other fields. Since these elements can be used in a higher-temperature environment than with the conventional elements, the packaging materials including encapsulation materials are required to have higher heat resistance and the capacity to be able to operate at high temperature. Here are given examples of packaging materials meeting such requirements of higher heat resistance and capacity to be able to operate at high temperature.

Insulation properties: Evaluation of temperature/ humidity dependence of volume resistance

Volume resistivity falls as temp. and humidity rises,
it falls significantly as temp.
goes beyond Tg.

Adhesive properties: Cross section observance with SEM for IC chip

Adhesive properties of each layer were satisfactory,
but it was observed that in some layers, there were voids.

Heat resistance (glass translation temp. (Tg),curing behavior)

Various evaluations of encapsulation materials

  • Evaluation of crosslinking density: Dynamic viscoelastic measurement, pulse NMR
  • Tracking hardening reaction: Time resolution FT-IR/pulse NMR
  • Evaluation of pyrolytic property: TGA measurement
  • Observation of filler dispersion: Cross section SEM observance

Search Number 9032

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