Evaluation of Bonded Interface of Different Types of Materials

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Weight-reducing technologies using metal/resin one-piece moldings, among other things are gathering attention and being putting into commercial use in a broad range of fields including electronic equipment and automobiles. An evaluation of the metal/resin bonded interface will make it possible to obtain useful information that will lead to the determination of the mechanisms of the development of adhesive strength and degradation.

Example of analysis: Observation of a cross section of a metal/resin one-piece molding

Example of analysis: Element mapping and concentration profile (element mapping by TEM-EDS)

A resin infiltration layer was confirmed in the surface layer section of the electrode oxidized film (alumite).

Bonding action based on physical adsorption as well as chemical adsorption at the bonded interface is suggested.

Search Number 4055

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